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Electrically Conductive Adhesives

There is a growing need of electrically conductive adhesives for the assembly and fabrication of electronic packaging devices, integrated circuits, solar cells/modules, LED (light emitting diode), LCD (liquid crystal display), OLED (organic light emitting diode display), RFID chips, etc. as these provide the critical functionality in conducting electricity by forming a mechanical bond between two surfaces. These are also viewed as safe and environmentally acceptable alternatives to conventional eutectic tin-lead soldering. The market opportunity as well as the technical needs of these materials are very significant with the increased adoption of flexible displays, curved screens and in-mold electronics.

Transportation and consumer electronic industries are the major market segments while Asia Pacific is the largest growth geography.  The adhesive chemistry is dominated by epoxy because it provides short cure time leading to overall improvement in processing time and productivity, improved electromagnetic and radiofrequency interference shielding. This is complimented by other type of chemistry like polyurethane, silicone and acrylic.

High loading of expensive electrically conductive fillers, like silver were often used in adhesive formulations. In order to reduce cost, silver coated metal (e.g. copper) fillers could be used.  However the electrical conductivity and thermal stability are often significantly compromised, opening up innovation space for cost effective electrically conductive adhesives with improved conductivity and stability.

Nano-sized fillers enable ink-jetting for higher precision.  In addition, conductive adhesives comprised of polyunsaturated resins, and carbon black filer with corrosion resistance and heat distortion resistance properties have also been reported.

References

  • “Electrically conductive adhesives 2016-2026”, by IDTechEx
  • Electrically Conductive Adhesives Market by Type, Chemistry (Epoxy, Silicone, Acrylic, Polyurethane), Application (Automotive, Aerospace, Consumer Electronics, Biosciences), Filler Material - Global Forecast to 2021", by Markets ad Markets, Nov., 2016
  • “Electrically conductive adhesives comprising silver-coated particles”,

    US9770886; https://patents.google.com/patent/US9770886B2/en

  • “Electrically conductive adhesives”, by R. Gomatam and K. L. Mittal, CRC Press, 2008
  • “Electrical Conductive Adhesives with Nanotechnologies”by Yi (Grace) LiD. Lu, and C.P. Wong; Springer, 2010
  • “Adhesive bonding”, Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14)
  • “Conductive adhesives”, US9011732; https://patents.google.com/patent/US9011732732



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This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [605658].

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